Intel R2308WFTZSR - Intel® C624 - LGA 3647 (Socket P) - Intel® Xeon® - DDR4-SDRAM - 6000 GB - 2.5,3.5"

Product number: R2308WFTZSR

Server System R2308WFTZSR - Single

Estimated delivery time 5 - 7 working days
Main features
Produktbeschreibung Intel Server System R2308WFTZSR - Rack-Montage - keine CPU - 0 GB - keine HDD
Product line Intel Server System
Type Server Barebone
Höhe (Rack-Einheiten) 2U
Server-Skalierbarkeit Zweiweg
Processor Keine CPU
Prozessorsockel Socket P
Massenspeicher-Controller RAID (SATA 6Gb/s)
Server-Speichereinschübe Hot-Swap 6.4 cm, 8.9 cm (2.5", 3.5")
Hard disk drive Keine HDD
Optischer Speicher Kein optisches Laufwerk
Netzwerk GigE, 10 GigE
Redundante Stromversorgung Optional
Abmessungen (Breite x Tiefe x Höhe) 43 cm x 71 cm x 8.74 cm
Type Server
Formfaktor des Produktes Rack-Montage - 2U
Integrierte Sicherheit Trusted Platform Module (TPM 2.0) Security Chip
Server-Skalierbarkeit Zweiweg
Anzahl interner Einbauschächte 4
Anzahl von vorne zugänglicher Einbauschächte 8
Anzahl Hot-Swap-Einbauschächte 8
Prozessor / Chipsatz
Max. Prozessoranzahl 2
CPU-Upgrade-Möglichkeit Upgradefähig
CPU-Anschluss Socket P
Chipset Intel C624
Installierte Anzahl 0 GB
Technologie DDR4 SDRAM - ECC
Form factor DIMM 288-PIN
Steckplatz 24 (Gesamt) / 24 (frei)
Leistungsmerkmale Registriert, Load-Reduced DIMM (LRDIMM)
Type Keine HDD
Controller Schnittstellentyp SATA 6Gb/s
RAID Level RAID 0, RAID 1, RAID 10
Optischer Speicher
Type Kein optisches Laufwerk
Monitortyp Keiner.
Ethernet-Ports 2 x 10 Gigabit Ethernet
Data Link Protocol Ethernet, Fast Ethernet, Gigabit Ethernet, 10 Gigabit Ethernet
Remoteverwaltungsprotokoll IPMI 2.0
Leistungsmerkmale Integriertes BMC mit IPMI
Einschübe 8 (gesamt)/ 8 (frei) x Hot-Swap-fähig 2,5" / 3,5" gemeinsam genutzt (6,4 cm/8,9 cm gemeinsam genutzt) ¦ 2 intern 2,5" / 2 x M.2 gemeinsam genutzt (M.2)
Steckplatz 6 (gesamt)/ 6 (frei) x PCIe 3.0 x8
Interfaces 5 x USB ¦ 2 x LAN (10Gigabit Ethernet) ¦ 2 x serial
Zubehör im Lieferumfang 2 x CPU Heatsink, Luftzufuhr, 12 GB SAS Backpanel, Standard-Kontrollbildschirm, E/A-Frontpanel, 6 x Systemventilatoren, 8 x DIMM-Steckplatzabdeckungen, Blindeinsatz für Netzanschlussfach, 2 x Riser Card-Schellen, 2 x PCIe Riser Cards mit 3 Steckplätzen, f
Gerätetyp Stromversorgung
Redundante Stromversorgung Optional
Installierte Anzahl 1
Gestellte Leistung 1300 Watt
Service und Support Begrenzte Garantie - 3 Jahre
Abmessungen und Gewicht
Width 430 mm
Tiefe 71 cm
Höhe 8.74 cm
eClass-10.1-ID 19010690
eClass-11.1-ID 19010690
eClass-6.2-ID 19010690
eClass-7.1-ID 19010690
eClass-8.1-ID 19010690
eClass-9.1-ID 19010690
eClass-ID 19019090
UNSPSC 20.0601 Code 43211501
custom tariff number 84715000
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

PCIe x4 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Integrated Graphics
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Intel® Optane™ Memory Supported
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Connector for Intel® Integrated RAID Module
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

PCIe OCuLink Connectors (NVMe support)
Onboard PCIe OCuLink connectors provide direct-attach NVMe SSD support.

Intel® Rapid Storage Technology enterprise
Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

# of UPI Links
Intel® Ultra Path Interconnect (UPI) links are a high speed, point-to-point interconnect bus between the processors, delivering increased bandwidth and performance over Intel® QPI.

Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Optane™ Persistent Memory Supported
Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance. Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.
No review available for this product.